Multi-Hole Process Plate Modification for Chip on Lead Device at Die Attach Process
نویسندگان
چکیده
منابع مشابه
Printable Die Attach Adhesives for Substrate-On-Chip Packaging
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ژورنال
عنوان ژورنال: Journal of Engineering Research and Reports
سال: 2020
ISSN: 2582-2926
DOI: 10.9734/jerr/2020/v18i317208